Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.
    • Research Interests
    ElectromigrationInterfacial ReactionDiffusion BarrierIntermetallic Compou...Intermetallic CompoundsHall Mobility2010202020032025
    20042024

    Papers共 99 篇Patents共 28 篇Author StatisticsCo-AuthorSimilar Experts

    By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
    时间
    引用量
    主题
    期刊级别
    合作者
    合作机构
    All20252024202320222021202020192018201720162015201420132012201120102009200820072006
    Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy
    Wei-Ting Lin, Kelvin Li, Kuo-Shu Lin, Chang-Meng Wang,Albert T. Wu
    JOMno. 6 (2025): 4215-4225
    Cited0Views0Bibtex
    0
    0
    Enhancing Performance and Thermal Stability in GeTe Thermoelectric Joints with Cobalt Diffusion Barrier
    Cheng-Hao Kung, Jyun-Yong Huang,Kai-Wen Cheng, Chun-Han Ku, Qi-Ming Huang,V. K. Ranganayakulu,Yang-Yuan Chen,Yan-Gu Lin,Shang-Jui Chiu,AlbertT. Wu
    MATERIALS CHEMISTRY AND PHYSICS (2024)
    Cited0Views7Bibtex
    0
    7
    Preventing Degradation of Thermoelectric Property after Aging for Bi2Te3 Thin Film Module
    Kai-Wen Cheng, Cheng-Hao Kung, Jyun-Yong Huang, Chun-Han Ku, Qi-Ming Huang,V. K. Ranganayakulu,Yang-Yuan Chen,Shang-Jui Chiu,Yan-Gu Lin,Chang-Meng Wang,Albert Wu
    Materials Chemistry and Physics (2024): 129208-129208
    Cited1Views9Bibtex
    1
    9
    Develop New Solder Alloy for High Reliability Device
    Albert T. Wu, Watson Tseng,Chang-Meng Wang, Wei-Ting Lin
    PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1144-1147, (2024)
    Cited0Views2Bibtex
    0
    2
    Enhancement of Cu-to-Cu Bonding Property by Residual Stress in Cu Substrate
    Hung Wang,Ping-Hsuan Chen, Cheng-Hao Kung, Po -Kai Chang,Shang-Jui Chiu,Yan-Gu Lin, Chan-Meng Wang,Albert T. Wu
    MATERIALS CHARACTERIZATION (2024)
    Cited0Views10Bibtex
    0
    10
    Cu Nanoparticle Sintering by Electrical Current
    Albert T. Wu, Tzu-Hao Sheng,Jui-Lin Chao,Chang-Meng Wang, Watson Tseng
    2024 International Conference on Electronics Packaging (ICEP)pp.107-108, (2024)
    Cited0Views5Bibtex
    0
    5
    Hybrid SnBi/SAC Low-Temperature Solder Bump
    Albert T. Wu,Jui-Lin Chao,Yu-Yuan Lai,Chang-Meng Wang
    2023 International Conference on Electronics Packaging (ICEP) (2023)
    Cited0Views4Bibtex
    0
    4
    Hybrid SnBi/SAC Low-Temperature Solder Bump
    Albert T. Wu,Jui-Lin Chao,Yu-Yuan Lai,Chang-Meng Wang
    2023 International Conference on Electronics Packaging (ICEP)pp.213-214, (2023)
    Cited0Views8Bibtex
    0
    8
    Load More
    Author Statistics
    00.20.40.60.81#Papers#CitationH-IndexG-IndexSociabilityDiversityActivity

    #Papers: 99

    #Citation: 1725

    H-Index: 23

    G-Index: 38

    Sociability: 5

    Diversity: 3

    Activity: 15

    Loading...
    • 合作者
    • 学生
    • 导师
    Hsin-Yi Lee合作论文数
    Department of Computer Science, National Chiao Tung University20
    Chang-Meng Wang合作论文数
    14
    Ching-Shun Ku合作论文数
    12
    Jui-Lin Chao合作论文数
    8
    Hsien-Chien Hsieh合作论文数
    8
    Tsan-Hsien Tseng合作论文数
    7
    hao chen合作论文数
    6
    King-Ning Tu (杜經寧)合作论文数
    Department of Materials Science and Engineering, City University of Hong Kong;Department of Electrical Engineering, City University of Hong Kong6
    Chihhao Chen合作论文数
    6
    Yangyuan Chen合作论文数
    6
    Kwang-Lung Lin合作论文数
    Department of Materials Science and Engineering, National Cheng Kung University6
    C. Robert Kao合作论文数
    Department of Materials Science and Engineering, National Taiwan University6
    Hsueh-Hsien Hsu合作论文数
    5
    Yang-Yi Lin合作论文数
    5
    Kai-Wen Cheng合作论文数
    5
    VK Ranganayakulu合作论文数
    5
    Chiu Shang-Jui合作论文数
    5
    Po Chen Lin合作论文数
    4
    Chun-Hsien Wang合作论文数
    4
    Hung Wang合作论文数
    4
    Chien-Hao Su合作论文数
    4
    Hsiao-Hsuan Hsu合作论文数
    4
    Yan-Gu Lin合作论文数
    Center for Condensed Matter Sciences, National Taiwan University4
    S. Chakroborty合作论文数
    Department of Physics, Indian Institute of Technology4
    tungyi chan合作论文数
    3
    Yu-Yuan Lai合作论文数
    3
    Tzu-Hao Shen合作论文数
    3
    Ping-Hsuan Chen合作论文数
    3
    Kuo-Shuo Huang合作论文数
    3
    Si-Wei Lin合作论文数
    3
    Boon-Ho Lee合作论文数
    3
    Li-Wei Chou合作论文数
    3
    Wen-Chih Lin合作论文数
    3
    y t huang合作论文数
    3
    Yao-Tsung Ouyang合作论文数
    3
    Zhen-Wei Sun合作论文数
    3
    Cheng-Yi Liu合作论文数
    3
    Yu-Ting Chang合作论文数
    3
    Yi-Shao Lai合作论文数
    Central Labs, Advanced Semiconductor Engineering, Inc.3
    Tao-Chih Chang合作论文数
    3
    Nico Li合作论文数
    2
    Yi-Ling Tsai合作论文数
    2
    Hua Fay合作论文数
    2
    Jyun-Jhe Huang合作论文数
    2
    Jeng-Yu Chiang合作论文数
    2
    dahbin kao合作论文数
    2
    Hsiang-Chuan Chen合作论文数
    2
    Y. C. Hsu合作论文数
    2
    Yi-Han Liao合作论文数
    2
    No result temporarily, you can search similar Scholar with the same research interest
    Data Disclaimer
    The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn