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Research Interests

Papers共 99 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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期刊级别
合作者
合作机构
Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy
Wei-Ting Lin, Kelvin Li, Kuo-Shu Lin, Chang-Meng Wang,Albert T. Wu
JOMno. 6 (2025): 4215-4225
Cited0Views0Bibtex
0
0
Enhancing Performance and Thermal Stability in GeTe Thermoelectric Joints with Cobalt Diffusion Barrier
Cheng-Hao Kung, Jyun-Yong Huang,Kai-Wen Cheng, Chun-Han Ku, Qi-Ming Huang,V. K. Ranganayakulu,Yang-Yuan Chen,Yan-Gu Lin,Shang-Jui Chiu,AlbertT. Wu
MATERIALS CHEMISTRY AND PHYSICS (2024)
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0
Preventing Degradation of Thermoelectric Property after Aging for Bi2Te3 Thin Film Module
Kai-Wen Cheng, Cheng-Hao Kung, Jyun-Yong Huang, Chun-Han Ku, Qi-Ming Huang,V. K. Ranganayakulu,Yang-Yuan Chen,Shang-Jui Chiu,Yan-Gu Lin,Chang-Meng Wang,Albert Wu
Materials Chemistry and Physics (2024): 129208-129208
Cited1Views0Bibtex
1
0
Develop New Solder Alloy for High Reliability Device
Albert T. Wu, Watson Tseng,Chang-Meng Wang, Wei-Ting Lin
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1144-1147, (2024)
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Enhancement of Cu-to-Cu Bonding Property by Residual Stress in Cu Substrate
Hung Wang,Ping-Hsuan Chen, Cheng-Hao Kung, Po -Kai Chang,Shang-Jui Chiu,Yan-Gu Lin, Chan-Meng Wang,Albert T. Wu
MATERIALS CHARACTERIZATION (2024)
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Cu Nanoparticle Sintering by Electrical Current
Albert T. Wu, Tzu-Hao Sheng,Jui-Lin Chao,Chang-Meng Wang, Watson Tseng
2024 International Conference on Electronics Packaging (ICEP)pp.107-108, (2024)
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Hybrid SnBi/SAC Low-Temperature Solder Bump
Albert T. Wu,Jui-Lin Chao,Yu-Yuan Lai,Chang-Meng Wang
2023 International Conference on Electronics Packaging (ICEP) (2023)
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Hybrid SnBi/SAC Low-Temperature Solder Bump
Albert T. Wu,Jui-Lin Chao,Yu-Yuan Lai,Chang-Meng Wang
2023 International Conference on Electronics Packaging (ICEP)pp.213-214, (2023)
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Author Statistics

#Papers: 99

#Citation: 1725

H-Index: 23

G-Index: 38

Sociability: 5

Diversity: 3

Activity: 15

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  • 导师
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