My experience is in fabrication and packaging of optical and electronic devices. I am currently trying to tackle challenging problems involving the novel optical devices that will be required for future exabit networks. In addition to exploring prototype devices and packages that exploit the nanometer control offered by additive manufacturing using high-resolution 3D printing, I expect to take advantage of the excellent central facilities available through my affiliations with the Division of Materials Science and the Photonics Center. More recently I am working to integrate both photonics and electronics in silicon using a commercial CMOS fabrication facility.