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Research Interests

Papers共 35 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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期刊级别
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TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays
Jennifer Ovental Hicks, Dean Malta, David Bordelon, Daniel Richter,Jaesub Hong,Jonathan Grindlay,Branden Allen,Daniel P. Violette,Hiromasa Miyasaka
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.170-177, (2021)
Cited6Views0EIWOSBibtex
6
0
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Author Statistics

#Papers: 35

#Citation: 404

H-Index: 10

G-Index: 20

Sociability: 6

Diversity: 2

Activity: 1

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  • 学生
  • 导师
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