基本信息
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Bio
Baron Huang received the B.S. and M.S. degrees in chemistry from National Cheng Kung University, Tainan, Taiwan, in 2004 and 2006, respectively.
In 2014, he joined Brewer Science, Inc., Rolla, MO, USA, where he devoted the research on temporary bonding materials and IC packaging polymer dielectrics.
Research Interests
Papers共 12 篇Author StatisticsCo-AuthorSimilar Experts
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期刊级别
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IMAPSource Proceedingsno. DPC (2024)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
Electronic Components and Technology Conferencepp.736-741, (2021)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (2021)
International Symposium on Microelectronicsno. 1 (2016): 000190-000195
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Author Statistics
#Papers: 12
#Citation: 69
H-Index: 5
G-Index: 8
Sociability: 4
Diversity: 1
Activity: 1
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