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Papers共 7 篇Author StatisticsCo-AuthorSimilar Experts

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Large Laminate and Die Coreless Substrate Packaging with Lid Ties
Edmund Blackshear,Brian W Quinlan,Benjamin Fasano, David J Lewison,Shidong Li, Hugues C Gagnon,Paul Fortier, Richard Heath, Frederick Roy, Elaine Cyr Takashi Nakajima, Yoichi Miyazawa, Itsuroh Shishido,Tomoyuki Yamada
International Symposium on Microelectronicsno. 1 (2014): 000074-000080
Cited1Views0Bibtex
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Author Statistics

#Papers: 7

#Citation: 407

H-Index: 4

G-Index: 6

Sociability: 5

Diversity: 1

Activity: 0

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