Christopher L. Borst - SUNY College of Nanoscale Science and Engineering

基本信息

浏览量：37

职业迁徙

个人简介

暂无内容

研究兴趣

论文共 27 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选

(Invited) Superconducting Qubits and Superconducting Digital Electronic Circuits on 300mm Wafers

Satyavolu S. Papa Rao,Christopher Hobbs,Stephen Olson,Neda Forouzani,Hyuncher Chong,Harlan Stamper,Brian Martinick,Dominic Ashworth,Vidya Kaushik,Kathleen A Dunn,Karsten Beckmann,Jakub Nalaskowski,Stephen Bennett,Martin Rodgers,Thomas Murray,Steven Novak, Brett Baker-O'Neal,Christopher Borst,Kevin Osborn,Michael Liehr

Meeting abstracts/Meeting abstracts (Electrochemical Society CD-ROM)no. 22 (2018): 1382-1382

引用1浏览0引用

Electrostatics and Performance Benchmarking Using All Types of III–V Multi-Gate FinFETs for Sub 7nm Technology Node Logic Application

R. -H. Baek,D. -H. Kim,T. -W. Kim,C. S. Shin, W. K. Park,T. Michalak,C. Borst,S. C. Song,Geoffrey Yeap,R. Hill,C. Hobbs,W. Maszara,P. Kirsch

2014 Symposium on VLSI Technology (VLSI-Technology) Digest of Technical Papers（2014）

引用3浏览0EIWOS引用

Comprehensive Layout and Process Optimization Study of Si and III-V Technology for Sub-7Nm Node

C. Y. Kang,R-H. Baek,T-W Kim,D. Ko,D-H. Kim,T. Michalak,C. Borst,D. Veksler,G. Bersuker,R. Hill,C. Hobbs,P. D. Kirsch

2013 IEEE International Electron Devices Meeting（2013）

引用1浏览0EIWOS引用

Simulation of Millisecond Laser Anneal on SOI: A Study of Dopant Activation and Mobility and Its Application to Scaled FinFET Thermal Processing

Michalak Tyler J.,Borst Chris, Franca Dan,Herman Josh,Rodgers Martin

MRS Proceedings（2013）

引用0浏览0引用

Driving metallization dimensions to sub-30nm using immersion lithography and a self-aligned double patterning scheme

Christopher Borst,Lior Huli,Stephen Bennett,Huixiong Dai,Christopher Bencher,Yongmei Chen

ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007) (2008): 403-407

引用0浏览0引用

Double Patterning Combined with Shrink Technique to Extend ArF Lithography for Contact Holes to 22nm Node and Beyond

Xiangqun Miao,Lior Huli,Hao Chen,Xumou Xu, Hyungje Wo,Chris Bencher,Jen Shu,Chris Ngai,Christopher Borst

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE（2008）

引用15浏览0引用

Modeling wafer level uniformity in electrochemical-mechanical polishing (ECMP)

Zhipeng Li,Daniel Truque,Duane Boning,Raymond Caramto,Christopher Borst

ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007) (2008): 131-+

引用0浏览0引用

Challenges and Rewards of Low-Abrasive Copper CMP: Evaluation and Integration for Single-Damascene Cu/Low-k Interconnects for the 90nm Node

Borst Christopher L.,Smith Stanley M., Eissa Mona

MRS Proceedings（2004）

引用25浏览0引用

Integrated Chip-Scale Prediction of Copper Interconnect Topography

Park Tae,Tugbawa Tamba,Cai Hong,Xie Xiaolin,Boning Duane, Chidambaram Chidi,Borst Chris, Shinn Greg

MRS Online Proceedings Library（2003）

引用1浏览0引用

加载更多

作者统计

合作学者

合作机构

D-Core

合作者
学生
导师

暂无相似学者，你可以通过学者研究领域进行搜索筛选

数据免责声明

页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn