Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.
Research Interests

Papers共 54 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
3D FO Package Technology Using Bridge Die for High Number of Chiplets Integration
Jiaming Zhuang, Shangxuan Li, X. C. Zhang, Ivan Chen, Bruce Chen, Simon Hsieh, Bohan Yang,C. Key Chung, Xin Xia
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2023)
Cited0Views0EIWOSBibtex
0
0
Overcome High Density Substrate Shortage by Using Fan out Chip Module
C. Key Chung, Luke Liu, Wuhong Cai, Jiaming Zhuang, Shangxuan Li, Peipei Shi
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2022)
Cited1Views0EIWOSBibtex
1
0
Characterizations of Micro Bump Undercuts for Chiplets Integrated Packaging
Min Xiang, Li Ma, Honglei Li,Wei Jiang,C. Key Chung
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022)
Cited0Views0EIWOSBibtex
0
0
Electrical Performances of Fan-Out Embedded Bridge
JinWei You,Jay Li,David Ho, Jackson Li, Ming Han Zhuang,David Lai,C. Key Chung,Yu-Po Wang
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2030-2034, (2021)
Cited9Views0EIWOSBibtex
9
0
Comparison of 3D Packages with 20m bump pitch using reflow soldering and thermal compression bonding
Mu Hsuan Chan, Chris Chuang,Yu Lung Huang,Wei Jhen Chen,Don Son Jiang,C. M. Huang,C. Key Chung
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.481-486, (2021)
Cited9Views0EIWOSBibtex
9
0
Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
Yu Lung Huang,C. Key Chung,C. F. Lin, Kuo Haw Yu, Rung Jeng Lin,Wilson Hong
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1102-1108, (2021)
Cited5Views0EIWOSBibtex
5
0
Load More
Author Statistics

#Papers: 54

#Citation: 791

H-Index: 20

G-Index: 26

Sociability: 4

Diversity: 2

Activity: 0

  • 合作者
  • 学生
  • 导师
No result temporarily, you can search similar Scholar with the same research interest
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn