Dimitri R. Kioussis - Department of Chemical and Biomolecular Engineering, University of Maryland

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论文共 21 篇作者统计合作学者相似作者

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The Projection of the Incidence of Dielectric Cracking During Chip Joining with Lead Free Solder Bumps

T. M. Shaw,X-H Liu,E. Misra,D. Questad,G. Bonilla,T. Wassick,H. Shobha, K. Smith,G. Osborne,D. Kioussis,J. Wright, R. Bisson, I. Paquin,M. Lamorey, S. S. Bouchard, S. Tetreault, D. Stone,C. Muzzy,B. Sundlof,T. Daubenspeck

IEEE International Reliability Physics Symposium（2016）

引用0浏览0EIWOS引用

The Strength of BEOL Structures Fabricated Using Low K Materials and Its Impact on CPI Failures

T. M. Shaw,X-H Liu,E. Misra,D. Questad,G. Bonilla,T. Wassick,M. Lamorey,H. Shobha,G. Osborne,D. Kioussis,J. Wright, R. Bisson, I. Paquin, S. S. Bouchard, S. Tetreault, D. Stone,C. Muzzy,B. Sundlof,T. Daubenspeck

2015 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW)（2015）

引用2浏览0EIWOS引用

METHODS OF FORMING A BI-LAYER CAP LAYER ON COPPER-BASED CONDUCTIVE STRUCTURES AND DEVICES WITH SUCH A CAP LAYER

D Kioussis, Youbo Lin, Zhiguo Sun

mag（2014）

引用23浏览0引用

Experimental Confirmation of Electron Fluence Driven, Cu Catalyzed Interface Breakdown Model for Low-K TDDB

Fen Chen,Jeffrey Gambino,Michael Shinosky,John Aitken,Elbert Huang,Stephan Cohen,Chih-Chao Yang, Dan Edelstein, Yun Wang, Terry Kane,Dimitri Kioussis

2012 IEEE International Reliability Physics Symposium (IRPS)（2012）

引用4浏览0EIWOS引用

CPI Challenges to BEOL at 28nm Node and Beyond

Vivian Ryan,Dirk Breuer,Holm Geisler,Dimitri Kioussis,Matthias U. Lehr,Jens Paul,Kashi Machani,Chirag Shah,Sven Kosgalwies,Lothar Lehmann, Jaesik Lee,Frank Kuechenmeister,E. Todd Ryan, Kamal Karimanal

2012 IEEE International Reliability Physics Symposium (IRPS)（2012）

引用15浏览0EIWOS引用

Optimization Of Porous Ultra Low-Kappa Dielectrics (Kappa <= 2.55) For 28nm Generation

D. Kioussis, E. T. Ryane,A. Madan,N. Klymko,S. Molis, Z. Sun, H. Masuda, S. Liang,T. Lee,D. Restaino,L. Clevenger,R. Quon,R. Augur,C. Child,S. M. Gates,A. Grill,H. Shobha,B. Sundlof,T. Shaw,G. Bonilla,T. Daubenspeck,G. Osborne, S. Cohen,K. Virwani

2011 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE AND MATERIALS FOR ADVANCED METALLIZATION (IITC/MAM) (2011)

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Competitive and Cost Effective Copper/low-K Interconnect (BEOL) for 28nm CMOS Technologies

R. Augur,C. Child, J. H. Ahn,T. J. Tang,L. Clevenger,D. Kioussis, H. Masuda,R. Srivastava, Y. Oda, H. Oguma,R. Quon,B. Kim,H. Sheng, S. Hirooka, R. Gupta, A. Thomas, S. M. Singh,Q. Fang, R. Schiwon,B. Hamieh,E. Wornyo, S. Allen,E. Kaltalioglu,G. Ribes, G. Zhang, T. Fryxell,A. Ogino, E. Shimada, H. Aizawa, H. Minda, S. O. Kim, T. Oki, K. Fujii, M. Pallachalil,T. Takewaki,C. K. Hu,B. Sundlof, D. Permana,T. Bolom,B. Enge,C. Labelle, B. Sapp,T. Nogami, A. Simon,H. Shobha,S. Gates,E. T. Ryan,G. Bonilla,T. Daubenspeck,T. Shaw,G. Osborne,A. Grill,D. Edelstein,D. Restaino,S. Molis,T. Spooner,P. Ferreira,G. Biery,R. Sampson

Microelectronic Engineering（2011）

引用5浏览0EI引用

A BEOL multilevel structure with ultra low-k materials (k ≤ 2.4)

Jiming Bao,Naftali E Lustig,E R Engbrecht, John T Gill,Ronald G Filippi,T C Lee,Kaushik Chanda,D Kioussis,Anthony Lisi, Tianlu Cheng,Andrew H Simon,P Flaitz,Jeonghyuk Choi,Weilung Tseng, E Zielinski,Stephen M Gates,A Grill,S Nguyen,H Shobha

Interconnect Technology Conference（2010）

引用2浏览0EIWOS引用

From Process Assumptions to Development to Manufacturing

Standaert Theo,Gabor Allen,Simon Andrew,Lisi Anthony,Peters Carsten,Child Craig,Kioussis Dimitri, Engbrecht Edward,Chen Fen,Baumann Frieder, Lembach Gerhard,Wendt Hermann,Choi Jihong,Linville Joseph,Chanda Kaushik,Kumar Kaushik,Davis Kenneth,Economikos Laertis,Nicholson Lee,Chae Moosung,Lustig Naftali, Bravo Oscar,McLaughlin Paul,Ravi Prakash Srivastava,Filippi Ronald,Sankaran Sujatha,Bolom Tibor,Menon Vinayan,McGahay Vincent,Li Wai-Kin,Tseng Wei-Tsu,Landers William,Choi Youngjin, Biery Glenn,Gow Thom

MRS Proceedings（2008）

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