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论文共 95 篇作者统计合作学者相似作者

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A Self-Consistent Tiling Method for Chip-Scale Stress Simulation
Chihak Ahn,Kyungmi Yeom,Alexander Schmidt,Yutaka Nishizawa,Anthony Payet,Seonghoon Jin,Yasuyuki Kayama,Woosung Choi,Dae Sin Kim
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)pp.1-4, (2024)
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Microscopic Structure and Dynamic Study in Amorphous InGaZnO Focusing on Oxygen-Centered Complex
Minhwan Lee,Juho Lee,Sungduk Hong,Sung Jin Kim,Dae Sin Kim
JOURNAL OF PHYSICAL CHEMISTRY Cno. 30 (2024): 12642-12648
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1
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Neural Drift-Diffusion Model Based on Operator Learning in Fourier Space
Kyeyeop Kim,Sanghoon Myung, Yunji Choi,Gijae Kang,Kyungmi Yeom, Songyi Han,Jaehoon Jeong,Dae Sin Kim
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)pp.1-4, (2024)
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Hardware Efficient Decomposition of the Laplace Operator and Its Application to the Helmholtz and the Poisson Equation on Quantum Computer
Jaehyun Bae, Gwangsu Yoo, Satoshi Nakamura, Shota Ohnishi,Dae Sin Kim
QUANTUM INFORMATION PROCESSINGno. 7 (2024)
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Origin of High Specific Contact Resistivity in TiN-InGaZnO Junctions
Juho Lee,Seongjae Byeon, Seunghyun Kim, Sung-Won Yoo,Wonsok Lee,Sungduk Hong,Min Hee Cho,Sung Jin Kim,Daewon Ha,Dae Sin Kim
IEEE ELECTRON DEVICE LETTERSno. 9 (2024): 1665-1668
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Generalization of Fick's Law and Derivation of Interface Segregation Parameters Using Microscopic Atomic Movements
Chihak Ahn,Joohyun Jeon, Seungmin Lee,Woosung Choi,Dae Sin Kim,Nick E.B. Cowern
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)pp.1-4, (2024)
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作者统计

#Papers: 95

#Citation: 592

H-Index: 13

G-Index: 22

Sociability: 6

Diversity: 2

Activity: 35

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