During that time I have received the Department of Commerce's highest award, the Gold Medal Award, and NIST's highest award for technical accomplishment, the Samuel Wesley Stratton Award, for my research on advanced on-chip interconnects for microelectronics as well as the Federal Laboratory Consortium's Award for Excellence in Technology Transfer for my work on solder interconnects.My 120+ technical paper detailing this work, and also cover topics ranging from 3D characterization of back contact thin film photovoltaics to mechanical, thermal and stability properties of multilayer materials, are cited more than 4000 times in the technical literature. I have received one US patent.