David Shaddock (Member, IEEE) received the B.S. degree in mechanical engineering from Carnegie Mellon University, Pittsburgh, PA, USA, in 1982, and the M.S. degree in electronics manufacturing from Rensselaer Polytechnic Institute, Troy, NY, USA, in 2005. He has been a Senior Engineer at General Electric Research, Niskayuna, NY, USA, since 1995. Prior to that, he held leadership and process engineering positions to developed processes for electronics assembly and component manufacturing at Rockwell Network Transmission Systems, Dallas, TX, USA (1985–1991), Rockwell Telecommunications, El Paso, TX, USA (1991–1995), and Motorola Inc. Components, Franklin Park, IL, USA (1982–1984), Motorola Inc. Cellular Systems, Schaumburg, IL, USA (1984–1985), He has more than 52 publications and holds 24 patents. His research interests include electronics manufacturing and reliability with a current focus on high-temperature electronics packaging, processes, and materials. Mr. Shaddock was a Nominated Rockwell Engineer of the Year in 1989 for the development of robotic assembly equipment. He received the GE Global Research Technology Award in 2018. He was a member (1999–2002) and the Chairperson (2002–2004) of the Board of Advisors Association of Electronic Manufacturing of the Society of Manufacturing Engineers.