By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2014): 001506-001522
1
0
Load More
Dingyou Zhang
Department of Electrical
Computer and Systems Engineering, Rensselaer Polytechnic Institute
Follow
Claim
分享
Follow
Claim
分享
基本信息
views: 38
Career TrajectoryBio
Dingyou Zhang received the B.S. degree in electronic engineering from Tsinghua University, Beijing, China, in 2008, and the M.S. and Ph.D. degrees in electrical engineering from Rensselaer Polytechnic Institute, Troy, NY, USA, in 2010 and 2013, respectively. Since 2013, she has been with GlobalFoundries packaging development organization, where she is currently a Principal Engineer, focusing on 3-D/TSV development for advanced technology nodes.
Research Interests
Author Statistics
#Papers: 24
#Citation: 253
H-Index: 10
G-Index: 15
Sociability: 4
Diversity: 2
Activity: 0
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn