Ferd Schleicher - Research Laboratories, Schering AG

基本信息

Career Trajectory

Bio

Filip Schleicher received the Ph.D. degree from the University of Strasbourg, Strasbourg, France, in 2012. His work was heavily fabrication oriented, with strong focus on mask design, thin film growth, lithography, etch and electrical characterization of final devices. After a cooperative Postdoctoral position shared between IPCMS,Strasbourg and IJL, Nancy, he joined the dry etch team at IMEC, in 2019. His research interests include N3 BEOL applications, lines/spaces, contact holes, and various 3D integration schemes.

Research Interests

Papers共 45 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选

Oxygen Vacancy-Driven Spin-Transfer Torque Across MgO Magnetic Tunnel Junctions

L. M. Kandpal,B. Taudul,E. Monteblanco, A. Kumar,K. Katcko,F. Schleicher, P. Gupta,S. Boukari,W. Weber,V. Da Costa, J. D. Costa,T. Bӧhnert, R. Ferreira, P. Freitas,M. Hehn,M. Alouani,P. K. Muduli, D. Lacour,M. Bowen

npj Spintronicsno. 1 (2025): 1-7

Cited0Views0WOSNATUREBibtex

Backside Power Delivery with Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-filled Slit Nano Through Silicon Vias

P. Zhao,L. Witters,A. Jourdain,M. Stucchi,N. Jourdan,J. W. Maes, H. Bana,C. Zhu, R. Chukka,F. Sebaai,K. Vandersmissen,N. Heylen,D. Montero,S. Wang,K. D'have,F. Schleicher,J. De Vos,G. Beyer,A. Miller,E. Beyne

IEEE TRANSACTIONS ON ELECTRON DEVICESno. 12 (2024): 7963-7969

Cited0Views0EIWOSBibtex

Machine Learning Methods for Voltage Contrast Yield Analysis

D. Cerbu,V. M. Blanco Carballo,F. Schleicher, J. van de Kerkhove,P. Leray, N. N. Kissoon,E. P. De Poortere

METROLOGY, INSPECTION, AND PROCESS CONTROL XXXVIII (2024)

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Optimization of Plasma Dicing Process for Die to Wafer Hybrid Bonding

Violeta Georgieva,Filip Schleicher, Ye Lin,Samuel Suhard,Anne Jourdain,Edward Walsby, Il Gyo Koo, Frederic Lazarino,Gerald Beyer,Eric Beyne

Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials (2024)

Cited0Views0Bibtex

BEOL N2: M2 Through SAxP Process from MP21 to MP26: 193i SAQP Vs EUV SADP

Yannick Hermans,Chen Wu, Nunzio Buccheri,Filip Schleicher,Janko Versluijs,Daniel Montero,Bappaditya Dey,Patrick Wong,Paulina Rincon-Delgadillo,Seongho Park,Zsolt Tokei,Philippe Leray,Sandip Halder

Optical and EUV Nanolithography XXXVI (2023)

Cited1Views0Bibtex

Detection of Bonding Voids in Multi-Tier Stacks with Scanning Acoustic Microscope

Cong Chen,John Slabbekoorn,Janusz Bogdanowicz,Alain Moussa,Boyao Zhang,Filip Schleicher,Peter Hoffrogge,Ingo Wiesler, Wassim Khaldi,Alain Phommahaxay,Christophe Beral,Gerald Beyer,Eric Beyne,Anne-Laure Charley,Philippe Leray

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.320-325, (2023)

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Integration of Plasma Dicing in the Collective Die to Wafer Hybrid Bonding Process

Samuel Suhard,Koen Kennes,Pieter Bex, Violeta Georgieva,Filip Schleicher,Edward Walsby, Richard Barnett,Anne Jourdain,Gerald Beyer,Eric Beyne

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.144-149, (2023)

Cited0Views0EIWOSBibtex

Studying the Efficacy of Hydrogen Plasma Treatment for Enabling the Etching of Thermally Annealed Ruthenium in Chemical Solutions

Q. T. Le, E. Gul Arslan,J. Rip,H. De Coster,P. Verdonck,D. Radisic,F. Schleicher,I. Vaesen,T. Conard,E. Altamirano-Sanchez

Micro and Nano Engineering (2023): 100208-100208

Cited3Views0Bibtex

Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

R. Chen,M. Lofrano,G. Mirabelli,G. Sisto,S. Yang,A. Jourdain,F. Schleicher,A. Veloso,O. Zografos,P. Weckx,G. Hiblot,G. Van der Plas,G. Hellings,J. Ryckaert,E. Beyne

2022 International Electron Devices Meeting (IEDM) (2022)

Cited12Views0EIWOSBibtex

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