基本信息
views: 108

Bio
He has significantly advanced this scientific field through his development of ground-breaking electronics cooling technologies. His engineering practice has not only impacted the academic community, but has also greatly influenced the consumer electronics, telecommunications and energy industries.Due to his pivotal discoveries, many types of electronic systems are able to maintain a higher performance even among the most challenging circumstances. His inventions have also led to improved performance, versatile, reliable, and commercially viable electronic systems for a wide variety of product offerings. He is the author of more than 90 technical papers and more than 100 US patents/ International Patents/ Pending patents. Dr. Refai is an Associate Editor of Journal Components and Packaging, IEEE and Journal of thermal Sciences and Engineering and Applications, Transactions of the ASME. Gamal is the recipient of 2008 excellent thermal management award, 2010 best Associate Editor J Electronics Packaging, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2015, the ASME service award and the 2016 IEEC SUNY Binghamton Innovation leader of the year.
Research Interests
Papers共 94 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.303-309, (2023)
G. Refai-Ahmed, S. Ramalingam, N. Karunakaran, M. Baharom, P. Yin, H. Do, C. Lee, S. Kelappen, P. Ramachandran, B. Murthy, B. Michael
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.834-841, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1022-1025, (2023)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.890-897, (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.909-913, (2022)
Load More
Author Statistics
#Papers: 94
#Citation: 1323
H-Index: 25
G-Index: 29
Sociability: 5
Diversity: 1
Activity: 1
Co-Author
Co-Institution
D-Core
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn