Hao Zhang

Hao Zhang received the B.S. and M.S. degrees from the Harbin University of Science and Technology in 2013 and 2015, respectively. He is currently pursuing the Ph.D. degree with the Beijing Research Centre of Delft University of Technology in Microelectronics. He has been with Boschman Technologies since 2016, and mainly focuses on the sintering and molding process of power devices. He has participated in one National High Technology Research and Development Program (863 Project). His main research interests include the modification of lead-free solders for microelectronic packaging, die-attach materials for power semiconductor packaging, as well as the reliability assessment and failure mechanism analysis of electronic components.