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论文共 65 篇作者统计合作学者相似作者

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A Technological Study of Lithographical Structuring of Aluminum on Select Low-Temperature-Cofire-Ceramic Surfaces
Uwe Ziegler,Heike Bartsch,Jens Müller
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2025): 1-1
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Simulations of Thermocouple Measurements During Reactive Bonding Processes on LTCC Substrates
Adam Yuile,Nesrine Jaziri,Erik Wiss,Jens Müller,Steffen Wiese
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-5, (2024)
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Investigation of Cavity Fabrication Methods for Integrated Horn Antenna Structures in Low Temperature Cofired Ceramic (LTCC) Substrates
Cathleen Kleinholz, Bjorn Muller, Michael Fischer,Marc Dreissigacker, Oliver Nallaweg,Christian Tschoban,Karl-Friedrich Becker,Martin Schneider-Ramelow,Jens Muller
Journal of Microelectronics and Electronic Packagingno. 4 (2024)
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Experimental Study on Reactive Joining Processes on LTCC Substrates
Erik Wiss,Nesrine Jaziri,Adam Yuile,Jens Müller,Steffen Wiese
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-4, (2024)
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Glass-LTCC-Interposer, a New Plattform for HF-Applications
Mahsa Kaltwasser,Alexander Schulz,Jens Müller
2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)pp.1-5, (2023)
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作者统计

#Papers: 65

#Citation: 354

H-Index: 9

G-Index: 17

Sociability: 5

Diversity: 2

Activity: 0

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