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个人简介
Jeremy A. Theil (M'88-SM'01) received the B.S. degree in metallurgical engineering and materials science from Carnegie Mellon University, Pittsburgh, PA, in 1985, the M.S. degree in materials science and engineering from the University of Illinois, Urbana-Champaign, in 1988, and the Ph.D. degree in materials science and engineering from North Carolina State University, Raleigh, in 1992.
He was with the Central Research Laboratory of Johnson Controls, Glendale, WI, from 1992 until 1995, when he joined HP Laboratories, Palo Alto, CA, of the Hewlett-Packard Company. He joined Hewlett-Packard's spin-off Agilent Technologies, Santa Clara, CA, in 1999, and stayed until 2005 when he joined Lumileds Lighting, San Jose, CA (now Philips Lumileds Lighting). At HP Laboratories, he pioneered the development of high quality a-Si.H p-i-n photodiodes for silicon CMOS image sensors. His interests include development of novel transducers and actuators that can be monolithically integrated into Si, and the development of high power light-emitting diodes.
Dr. Theil is also a member of the Materials Research Society (MRS), and the American Vacuum Society. He is an inventor of over 44 patents, has authored 33 papers, and chaired the 2005 MRS Symposium on Monolithic Instruments.
研究兴趣
论文共 83 篇作者统计合作学者相似作者
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Phillip Tyler, Ian Cochran, Jonathan Fijal, John Taddei,Thomas Workman,Dominik Suwito,Guilian Gao,Gabe Guevara,Gill Fountain,Cyprian Uzoh,Jeremy Theil,Laura Mirkarimi
IMAPSource Proceedingsno. DPC (2024)
IMAPSource Proceedingsno. DPC (2024)
IMAPSource Proceedingsno. DPC (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.83-90, (2023)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
2020 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC) (2020)
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作者统计
#Papers: 83
#Citation: 2160
H-Index: 29
G-Index: 41
Sociability: 5
Diversity: 2
Activity: 1
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