Kai-Ming Yang

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Bio

Kai-Ming Yang received the B.S. degree from the Industrial Engineering Department, Da Yeh University, Changhua, Taiwan, in 2001. Since 2010, he has been with the Unimicron Technology Corporation, Taoyuan City, Taiwan, where he is currently the Deputy Manager and In Charge of the New Business Development Division under CEO Office, where he was involved in the integrated embedded interposer carrier substrate technology development. He is also currently in charge of the fan-out panel-level packaging substrate and assembly technology development.

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