I have over 12 years of experience in the semiconductor industry (most recently with Intel Corp) as a Transmission Electron Microscopy associate preparing TEM samples and performing TEM/STEM/SEM analysis. My primary responsibilities at CFN are to serve as the principal point of contact for the FEI F200X Talos Operando TEM/STEM as well as conduct ultrathin electron-transparent sample preparation using a variety of mechanical and non-mechanical thinning methods, including dual beam FIB/SEM In situ lift-out (lamella and tomography samples), tripod polishing, dimpling, jet etching and, ion-milling techniques in support of users and scientific staff. I also maintain and manage the TEM preparation laboratory at CFN.