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Research Interests

Papers共 98 篇Author StatisticsCo-AuthorSimilar Experts

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Low Temperature (250°C) and Fine Pitch (≤4 Μ M) New Nanocrystalline Cu/SiO2 Chip-on-Wafer Hybrid Bonding for 3D Chip Integration
Ang-Ying Lin,Yu-Min Lin,Chun-Lin Lu, Hsin-Yi Liao, Chen-Chun Yu,Ou-Hsiang Lee, Tsung-Chieh Chiu,Wei-Lan Chiu,Hsiang-Hung Chang,Shou-Zen Chang
2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA (2024)
Cited0Views0EIWOSBibtex
0
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Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive
Tsung- Yu Ouyang,Yu-Min Lin, Yu-Ping Chan,Ou-Hsiang. Lee,Ching-Kuan Lee,Hsiang-Hung Chang,Chin-Hung Wang,Wei-Chung Lo, Po- Yao Chuang, Ying-Chung Tseng,Po-Hao Tsai,Michael Gallagher,Christopher Gilmore
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
Cited0Views0EIWOSBibtex
0
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Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive
Tsung-Yu Ouyang,Yu-Min Lin, Yu-Ping Chan,Ou-Hsiang Lee,Ching-Kuan Lee,Hsiang-Hung Chang,Chin-Hung Wang,Wei-Chung Lo, Po-Yao Chuang, Ying-Chung Tseng, Po-Hao Tsai,Michael Gallagher,Christopher Gilmore
2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA (2024)
Cited0Views0Bibtex
0
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Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process
Ou-Hsiang Lee,Wei-Lan Chiu,Hsiang-Hung Chang,Chia-Wen Chiang, Shih-cheng Yu,Tsung-Yu Ou Yang, Su-Ching Hsiao,Ting-Yu Ko,Yu-Min Lin,Chin-Hung Wang,Wei-Chung Lo,Chia-Hsin Lee, Chung-An Tang,Michelle Fowler, Maycic Lubbers
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1863-1867, (2024)
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Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding
Chia-Hsin Lee, Chung-An Tan,Michelle Fowler,Ting-Yu Ko,Yu-Min Lin,Wei-Lan Chiu,Ou-Hsiang Lee,Kuan-Neng Chen
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 8 (2023): 1316-1323
Cited3Views0EIWOSBibtex
3
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A Novel Polymer-Based Ultra-High Density Bonding Interconnection
Yu-Min Lin,Tsung-Yu Ou Yang,Ou-Hsiang Lee,Ching-Kuan Lee, Hsiu-Kuei Ko, Yi-Shu Chen,Hsiang-Hung Chang,Michael Gallagher,Christopher Gilmore, Po-Yao Chuang, Ying-Chung Tseng,Po-Hao Tsai, Po-Chun Huang,Chang-Chun Lee
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1779-1784, (2023)
Cited1Views0EIWOSBibtex
1
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D-Mode GaN HEMT with Direct Drive
Vanessa Heumesser,Jih-Sheng Lai,Hsin-Che Hsieh,Johnny Hsu,Chih-Yi Yang,Edward Y. Chang, Hsiu-Kuei Ko, Wen-Hung Liu,Yu-Min Lin
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)pp.1-6, (2023)
Cited1Views0EIWOSBibtex
1
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High density batch bonding technology for chiplet design
Ang-Ying Lin,Yu-Min Lin, Tzu-Hsuan Ni,Tao-Chih Chang,Chang-Chun Lee
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)pp.1-2, (2022)
Cited1Views0EIWOSBibtex
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Author Statistics

#Papers: 98

#Citation: 1293

H-Index: 23

G-Index: 30

Sociability: 5

Diversity: 2

Activity: 2

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