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Research Interests

Papers共 60 篇Author StatisticsCo-AuthorSimilar Experts

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A Systematic Study of Charge-Trapping Phenomenon in FeFET on FDSOI Via Low-Frequency Noise Spectroscopy
Qingxiao Zhu, Lihua Xu,Yuan Wang,Yue Zhao,Lingfei Wang,Qing Luo
IEEE ELECTRON DEVICE LETTERSno. 2 (2025): 195-198
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High-Performance Polymer Monolayer Transistors with Sub-20 Nm Channel Lengths
Mengmeng Li, Jiebin Niu, Xufan Li, Yue Tian, Chenming Ding, Congyan Lu,Zhenzhong Yang,Rong Huang,Lingfei Wang, He Yan,Ling Li,Ming Liu
Advanced materials (Deerfield Beach, Fla)pp.e2420201-e2420201, (2025)
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TCAD Simulation Study of Cylindrical Vertical Double-Surrounding-Gate A-Ingazno FETs and Geometric Parameter Optimization
Yue Zhao, Lihua Xu,Chuanke Chen, Xufan Li, Kexin Shang,Di Geng,Lingfei Wang,Ling Li
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY (2025): 66-72
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IGZO 2T1C DRAM with Low Operation Voltage and High Current Window
Wendong Lu, Kaifei Chen, Menggan Liu, Fuxi Liao, Zijing Wu, Naide Mao, Zihan Li, Xuanming Zhang, Congyan Lu, Jiebin Niu, Bok-Moon Kang, Jing-hong Shi, Xie-Shuai Wu,Gui-Lei Wang, Zhengyong Zhu,Jiawei Wang,Lingfei Wang,Di Geng,Nianduan Lu, Guanhua Yang,Chao Zhao,Ling Li
IEEE Journal of the Electron Devices Societyno. 99 (2025): 1-1
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A Physics-Based Compact Electrothermal Model of Β-Ga2o3 MOSFETs for Device-Circuit Co-Design
Kai Zhou,Xuanze Zhou,Song He,Guangwei Xu,Lingfei Wang, Yibo Wang,Genquan Han,Shibing Long
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 12 (2024): 2231-2239
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Author Statistics

#Papers: 61

#Citation: 465

H-Index: 12

G-Index: 20

Sociability: 5

Diversity: 2

Activity: 10

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