Mukta Ghate Farooq

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Bio

Her expertise includes semiconductor materials and structures, CMOS FET BEOL (Back End of Line), Heterogeneous Integration, 3-Dimensional (3D) Integration, flip-chip and die stacking technology, lead-free alloys, C4, Cu hybrid bonding, micropillar, ball / column grid arrays, chip package interaction, packaging technology, and intellectual property development. She was awarded an Outstanding Technical Achievement Award for her pioneering and sustained contributions to IBM's 3D Technology.

Research Interests

Papers共 154 篇Author StatisticsCo-AuthorSimilar Experts

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My Story [women in Electron Devices]

Mukta Farooq

IEEE Electron Devices Magazineno. 1 (2024): 6-47

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Modeling Ofthe Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages

Prabudhya Roy Chowdhury,Sathya Raghavan, Luke Darling,Aakrati Jain, Promod R. Chowdhury,Mukta Ghate Farooq,Katsuyuki Sakuma

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1418-1425, (2023)

Cited1Views0EIWOSBibtex

Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for HighPower Computing Applications

Aakrati Jain,Risa Miyazawa,Sathya Raghavan,Prabudhya Roy Chowdhury,Mukta Ghate Farooq,Arvind Kumar,Katsuyuki Sakuma

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

Cited3Views0EIWOSBibtex

Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications

Qianwen Chen,Michael Belyansky,Yasir Sulehria,Akihiro Horibe, Liqiao Qin,Ruturaj Pujari,Eric Perfecto,Fee Li Lie,Shahid Butt, Nick Polomoff,Risa Miyazawa,Sayuri Kohara,Mukta Farooq,Takashi Hisada,Jennifer Oakley,Spyridon Skordas,Susan Fan,Katsuyuki Sakuma,John Knickerbocker,Dale Mcherron,Takeshi Tamura,Takayuki Ishii, Panupong Jaipan, Satoshi Nishimura,Ilseok Son,Yohei Maeda,Takashi Koga, Joseph Klein, Kei Tashiro,Sitaram Arkalgud,Yoshihiro Kondo

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1175-1180, (2023)

Cited2Views0EIWOSBibtex

CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs

Risa Miyazawa,Hiroyuki Mori,Aakrati Jain,Mukta Farooq,Takashi Hisada

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2023)

Cited1Views0EIWOSBibtex

Thermal Solution for Co-Packaged Optics (CPO) Modules

Keiji Matsumoto,Mukta Farooq,John Knickerbocker

2022 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) (2022)

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Functional Testing of AI Cores Through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules

Mukta Farooq,Arvind Kumar,Sae-Kyu Lee,Ravi Bonam,Juan-Manuel Gomez,James Kelly,Kohji Hosokawa,Akiyo Nomura,Yasuteru Kohda,Timothy Dickson,Katsuyuki Sakuma,Hiroyuki Mori, Joshua Rubin,Iqbal Saraf,Vinay Pai,Pablo Nieves, Yandong Li, Abraham DelaPena,Thomas Wassick,Eric Perfecto, Christopher Carr, Viraj Sardesai,Eric Miller,Jennifer Oakley,Spyridon Skordas,Sean Teehan,Dale McHerron, Jeff Burns,Rama Divakaruni

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)

Cited1Views0EIWOSBibtex

3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55 m-75 m Mixed Pitch Interconnections on High Density Laminate

Katsuyuki Sakuma,Mukta Farooq,Paul Andry,Cyril Cabral,Sankeerth Rajalingam,Dale McHerron,Shidong Li, Russell Kastberg,Thomas Wassick

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.292-297, (2021)

Cited8Views0EIWOSBibtex

3-D Die Stacking with 55 Μ M Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System

Katsuyuki Sakuma,Mukta Farooq,Paul Andry,Cyril Cabral,Thomas Wassick,Dale McHerron,Rama Divakaruni

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2021）

Cited8Views0EIWOSBibtex

Finite Element Method (FEM) Simulation Based Analysis for Optimal Chip Layout of a 2.5D Flip Chip Package

Manish Nayini,David Questad,Mukta Farooq

2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)pp.1-3, (2018)

Cited1Views0EIWOSBibtex

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Distinguished Research Scientist

Papers共 154 篇Author StatisticsCo-AuthorSimilar Experts