基本信息
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个人简介
Mark Shaw received the B.Sc.(Hons.) degree in applied physics from
the Univeristy of Wales, Cardifff, U.K., in 1984. He was with Avanex, Bookham, Mesophotonics, Pirelli, Nortel, and
Plessey, where he had various optoelectronics packaging engineering roles. In 2006, he joined STMicroelectronics
working on MEMS packaging, where he is currently responsible for the development of silicon photonics packaging
solutions within the Digital and Mixed Processes ASIC Division. He is the Author of several published articles and has
been granted numerous patents in the field of packaging particularly in optoelectronics and MEMS.
研究兴趣
论文共 22 篇作者统计合作学者相似作者
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Mark Shaw, Daniele Simoncini,Roseanne Duca,Luca Falorni, Paola Carulli, Patrick Fedeli, Davide Brignoli, Haiyang Cheng, Jane Wanzel Rillera
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)pp.684-689, (2024)
Alex Gritti, Andrea Ratti,Mark Shaw, Kim-Sing Wong, Hung Meng Loh, Alessandra Casati, Ernesto Antilano, Alvin Soreda
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)pp.1061-1068, (2024)
Alessandro S. Savoia,Monica La Mura, Mohammad Mahdi Dehghan Pir,Enrico Boni,Alessandro Ramalli,Piero Tortoli, Rahul Dutta, Vempati Srinivasa Rao, David Ho Soon, Carlo Luigi Prelini,Mark Shaw,Domenico Giusti
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)pp.1-4, (2024)
Mark Shaw, Vladimir Papic
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.291-295, (2023)
Dominica Giusti,Alex Gritti,Fabio Quaglia,Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino,Dutta Rahul,Vempati Srinivasa Rao,David Ho Soon Wee, Masatoshi Wakahara,Mark Shaw
Andrea Ratti, Daniele Simoncini, Annabel Adolfo,Marco Del Sarto,Alex Gritti,Patrick Fedeli,Luca Maggi, Teresa Napolitano,Mark Andrew Shaw,Jefferson Talledo
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-6, (2023)
2022 IEEE International Ultrasonics Symposium (IUS) (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.280-285, (2022)
Domenico Giusti, Hitoshi Hoshino, Gerald Klug,Fabio Quaglia, Hideyuki Sandoh,Mark Shaw, Masatoshi Wakahara
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-5, (2021)
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作者统计
#Papers: 22
#Citation: 275
H-Index: 8
G-Index: 12
Sociability: 4
Diversity: 1
Activity: 0
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