Mark D. Poliks is an Empire Innovation Professor of engineering, a Professor of systems science and industrial engineering, a Professor of materials science and engineering, and the Director of the Center for Advanced Microelectronics Manufacturing (CAMM), State University of New York at Binghamton, Binghamton, NY, USA. He is the Chair of the Smart-Energy Transdisciplinary Area of Excellence, Binghamton University. He held senior technical management positions at IBM Microelectronics, Endicott, NY, USA, and Endicott Interconnect, Endicott, NY, USA. He has authored more than 100 technical articles and holds 48 U.S. patents. His research interests include high-performance electronics packaging, flexible hybrid electronics, materials, processing, roll-to-roll manufacturing, in-line quality control, and reliability. Dr. Poliks is a member of technical councils for FlexTech Alliance, the Nano-Bio Manufacturing Consortium (NBMC), and NextFlex, and has served on the NextFlex Governing Council. He was a recipient of the SUNY Chancellor’s Award for Excellence in Research. He leads the New York State NextFlex Node and was named a 2017 NextFlex Fellow. He served as the General Chair of the 69th IEEE/EPS Electronics Components and Technology Conference (ECTC) and co-organized a National Science Foundation/NextFlex Workshop on “Accelerating Innovative Manufacturing Technologies for Flexible Hybrid Electronics.”