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Papers共 22 篇Author StatisticsCo-AuthorSimilar Experts

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Die Attach Material Choice for MEMS Cavity Packages
Mark Shaw, Daniele Simoncini,Roseanne Duca,Luca Falorni, Paola Carulli, Patrick Fedeli, Davide Brignoli, Haiyang Cheng, Jane Wanzel Rillera
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)pp.684-689, (2024)
Cited0Views0EIWOSBibtex
0
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Routable Wettable Flanks for MEMS Devices
Alex Gritti, Andrea Ratti,Mark Shaw, Kim-Sing Wong, Hung Meng Loh, Alessandra Casati, Ernesto Antilano, Alvin Soreda
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)pp.1061-1068, (2024)
Cited0Views0EIWOSBibtex
0
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Advanced 3-D Packaging for Integrated 2-D PMUT Arrays and Front-End Circuits
Alessandro S. Savoia,Monica La Mura, Mohammad Mahdi Dehghan Pir,Enrico Boni,Alessandro Ramalli,Piero Tortoli, Rahul Dutta, Vempati Srinivasa Rao, David Ho Soon, Carlo Luigi Prelini,Mark Shaw,Domenico Giusti
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)pp.1-4, (2024)
Cited0Views0EIWOSBibtex
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Redistribution Layer Routing Optimization Using the Variation of Trace Thickness and Length to Equalize Trace Parasitics
Mark Shaw, Vladimir Papic
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.291-295, (2023)
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From MEMS Strip to MEMS Unit: a Comprehensive Simulation Approach to Warpage
Andrea Ratti, Daniele Simoncini, Annabel Adolfo,Marco Del Sarto,Alex Gritti,Patrick Fedeli,Luca Maggi, Teresa Napolitano,Mark Andrew Shaw,Jefferson Talledo
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-6, (2023)
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0
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Co-packaging of PMUT Array with FOWLP ASIC's
Domenico Giusti,Fabio Quaglia,Dutta Rahul,Vempati Srinivasa Rao,Alessandro Savoia,Mark Shaw,David Ho Soon Wee
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.280-285, (2022)
Cited5Views0EIWOSBibtex
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Back Cavity Formation on 50µm Thick Bumped PMUT Wafers
Domenico Giusti, Hitoshi Hoshino, Gerald Klug,Fabio Quaglia, Hideyuki Sandoh,Mark Shaw, Masatoshi Wakahara
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
Cited2Views0EIWOSBibtex
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Assembly of Opto-Mechanical Devices
Marco Del Sarto,Luca Maggi,Mark Andrew Shaw,Anders Simonsen,Albert Schliesser,Marco Moraja,Luca Mauri, Marco Campaniello,Davide Rotta,Aina Serrano Rodrigo,Antonella Bogoni
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-5, (2021)
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Author Statistics

#Papers: 22

#Citation: 275

H-Index: 8

G-Index: 12

Sociability: 4

Diversity: 1

Activity: 0

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