Ivan Ndip

Ivan Ndip (M’05–SM’12) received the Dipl.-Ing. (M.Sc.) and Dr.-Ing. (Ph.D.) degrees (summa cum laude) in electrical engineering from the Technical University (TU) of Berlin, Germany, in 2002 and 2006, respectively, and the Dr.-Ing. habil. degree also in electrical engineering from the Brandenburg University of Technology, Cottbus-Senftenberg, Germany, in 2017. He joined the Fraunhofer Institute for Reliability and Microintegration, IZM, Berlin, as a Student Research Assistant in 2000 and a Research Engineer in 2002. In 2005, he was appointed as the Manager with the RF Modeling and Simulation Group. He established the RF and High-Speed System Design Group, IZM, in 2006, and served as the Founding Group Manager until 2015. From 2005 to 2015, he built up and led a dynamic team of RF engineers/scientists at IZM. During this period of 10 years, he led research and development projects with national and international partners in the areas of RF characterization of dielectric materials; high-frequency modeling, design, and optimization of RF/wireless components (e.g., antennas), modules, and systems for communication and radar sensing applications; high-speed modeling, design, and characterization for signal/power integrity and EMC. Since 2014, he has been the Head of the Department of RF and Smart Sensor Systems, IZM, where he leads research and development activities in five research groups and manages the department. He has been a Lecturer with the School of Electrical Engineering and Computer Sciences, TU of Berlin, since 2008. He also teaches Professional Development Courses to practicing engineers and scientists worldwide. He has authored or co-authored over 175 publications in referred journals and conference proceedings. He is an inventor and holds many patents and patent applications. Dr. Ndip is a member of the Technical Program Committee of many IEEE and IMAPS international conferences. He is a fellow and a Life Member of IMAPS. He serves as a Director of the IMAPS Executive Council. He was a recipient of numerous best paper awards, the Tiburtius Prize, awarded yearly for outstanding Ph.D. dissertations in the state of Berlin, and the 2012 Fraunhofer IZM Research Award for his work on the development and successful application of novel methodologies, models, and design measures for optimization of high-frequency and high-speed systems. He received the 2016 John A. Wagnon Technical Achievement Award from the International Microelectronics Assembly and Packaging Society (IMAPS) for his outstanding technical contributions to the microelectronics industry worldwide. He chairs the Signal and Power Integrity Committee of IMAPS. He was the Technical Co-Chair of the 44th and 45th International Symposiums on Microelectronics, Long Beach, CA, USA, and San Diego, CA, USA, in 2011 and 2012, respectively. In 2013, he was the Technical Chair of the 46th International Symposium on Microelectronics, Orlando, FL, USA, and in 2014, he became the General Chair of the 47th International Symposium on Microelectronics, San Diego, CA, USA. He also served as the General Chair of the 19th IEEE Workshop on Signal and Power Integrity, Berlin, in 2015. He is also a Reviewer for the IEEE Transactions on Electromagnetic Compatibility, the IEEE Transactions on Components, Packaging, and Manufacturing Technology, the IEEE Transactions on Microwave Theory and Techniques, the IEEE Transactions on Electron Devices, and other international journals. He is an Associate Editor of the Journal of Microelectronics and Electronic Packaging.