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Research Interests

Papers共 7 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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引用量
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期刊级别
合作者
合作机构
Cleaning and Particle Challenges in the Temporary Bonding and Debonding Process
Joel A. Bahena, Hunter Jones, Kevin Donnelly, John Taddei,Phillip Tyler, Amit Kumar,John Massey, Seth Molenhour, Yongqing Jiang
IMAPSource Proceedingsno. Symposium (2024)
Cited0Views0Bibtex
0
0
Sustainable Solvent Metal Lift-off for Compound Semiconductor Fabrication with Improved Manufacturability
Pradeep Waduge, Khody Javaherchi, Joel A. Bahena, Mikhail Doble,Phillip Tyler, Lynne Michaelson, Douglas Holmes
MICROELECTRONIC ENGINEERING（2023）
Cited3Views0EIBibtex
3
0
An Evaluation of Bath Life Effects on Photoresist Removal for Wafer Level Packaging
Joel A. Bahena,Phillip Tyler,John Taddei,Muthumanickam Sankarapandian, Jamie Prudhomme, Karthikeyan Pillai, Abdullahi Said, Christopher Carr,Dario Goldfarb, Chris Waskiewicz,Qianwen Chen
IMAPSource Proceedingsno. Issue 1 (2023)
Cited0Views0Bibtex
0
0
Development of Advanced Lift-Off Processes for 5G and VCSEL Applications
Phillip E. Tyler,Jonathan Fijal, Kenji Nulman, A. Vijayendran, D. Rennie, J. Rieker,A. Dioses, J. Zook, John P. Sagan, P. Greene, S. Deng,Laura B. Mauer
semanticscholar（2019）
Cited1Views0Bibtex
1
0
TEMPORARY BONDING AND THE CHALLENGE OF CLEANING POST-DEBOND
Phillip Tyler, Kenji Nulman,Laura Mauer,Michelle Fowler, Seth Molenhour
2018 International Wafer Level Packaging Conference (IWLPC)pp.1-7, (2018)
Cited2Views0EIWOSBibtex
2
0
Author Statistics

#Papers: 7

#Citation: 6

H-Index: 2

G-Index: 2

Sociability: 3

Diversity: 1

Activity: 1

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  • 导师
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