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Research Interests

Papers共 867 篇Author StatisticsCo-AuthorSimilar Experts

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Prediction of High Strain Rate Properties of SAC-Bi Solders under Sustained High-Temperature Operation
Vishal Mehta,Pradeep Lall
2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific)pp.1-14, (2025)
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Interface Fracture Characterization and Prediction of Competing Risk-of-Failure in FCBGAs under Automotive Sustained Humidity and Temperature Exposure
Aathi Pandurangan, Padmanava Choudhury,Madhu Kasturi,Pradeep Lall
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2025)
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Physics-Based Assessment of Interface Fracture in FCBGAs under Sustained Humidity and Temperature Exposure
Aathi Pandurangan,Padmanava Choudhury,Pradeep Lall
2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific)pp.1-9, (2025)
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Damage Life-Prediction Model for Doped Lead-Free SnAgCu Solder Electronic Assemblies under High Strain Rate Vibration after Prolonged Storage
Vsiahl Mehta,Pradeep Lall
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2025)
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Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits
Pradeep Lall,Ved Soni,Sabina Bimali,Daniel Karakitie,Scott Miller
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.982-989, (2024)
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Mechanical Property Evolution in SAC+Bi Lead Free Solders Subjected to Various Thermal Exposures
Mohammad Al Ahsan,S. M. Kamrul Hasan,Souvik Chakraborty,Jeffrey C. Suhling,Pradeep Lall
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1460-1467, (2024)
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Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders under Sustained High-Temperature Operation
Pradeep Lall,Vishal Mehta,Mrinmoy Saha,Jeff Suhling,David Locker
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1530-1537, (2024)
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Mechanical Characterization and Aging Behavior of Isac Lead Free Solder
Golam Rakib Mazumder,Souvik Chakraborty,Mahbub Alam Maruf,Jeffrey C. Suhling,Pradeep Lall
ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2024)
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Modeling of the Temperature Cycling Performance of BGA Packages with Hybrid SAC-LTS Joints and Various Bi Concentration Gradients
Souvik Chakraborty,Debabrata Mondal, Jeffrey C. Suhling,Pradeep Lall
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2024)
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Author Statistics

#Papers: 867

#Citation: 9760

H-Index: 49

G-Index: 74

Sociability: 6

Diversity: 1

Activity: 4

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