Stefan Radloff

Stefan Radloff received the B.S. degree in mechanical engineering from the University of Tulsa, Tulsa, OK, USA, in 1993, and the M.S. degree in mechanical engineering from the Massachusetts Institute of Technology, Cambridge, MA, USA, in 1995. In 1995, he joined Intel, Chandler, AZ, USA, where he has been a part of Intel’s Global Supply Management, Technology and Manufacturing Group. Since 2006, he has been a Technologist and has worked in a variety of roles across Intel’s capital supply chain organization, including key roles in Intel’s 300- and 450-mm wafer size transition programs. He has expertise in factory integration, industry standards, automation and equipment interfaces, wafer carriers, equipment performance, and supply chain management. He was the Co-Chair of the SEMI Advanced Semiconductor Manufacturing Conference in 2013.