基本信息
浏览量:154

个人简介
Domain expert with 10+ years industry experience from project management, high-performance energy-efficient ASIC/PCB, to Python/C++ script development for AI/ML workloads. Architect and principal investigator for PDK development, batteryless electronics, edge ML, and on-device generative AI. Awards from US government contracts for HW/SW/algorithm design. Fellow of NextFlex, Senior Member of IEEE, Inventor of 50+ US patents, Author/co-author of 50+ publications, Invited speaker at trade shows and academic conferences, Mentor of young scientist/engineer/post-doc/professor, Enthusiast in outdoor activities and sports.
研究兴趣
论文共 68 篇作者统计合作学者相似作者
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OSTI OAI (US Department of Energy Office of Scientific and Technical Information) (2021)
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OSA Advanced Photonics Congress 2021 (2021)
Yvan Bonnassieux,Christoph J. Brabec,Yong Cao,Tricia Breen Carmichael,Michael L. Chabinyc, Kwang-Ting Cheng,Gyoujin Cho, Anjung Chung,Corie L. Cobb,Andreas Distler,Hans-Joachim Egelhaaf,Gerd Grau,Xiaojun Guo,Ghazaleh Haghiashtiani,Tsung-Ching Huang,Muhammad M. Hussain,Benjamin Iniguez,Taik-Min Lee,Ling Li,Yuguang Ma,Dongge Ma,Michael C. McAlpine,Tse Nga Ng,Ronald osterbacka,Shrayesh N. Patel,Junbiao Peng,Huisheng Peng,Jonathan Rivnay,Leilai Shao,Daniel Steingart,Robert A. Street,Vivek Subramanian,Luisa Torsi,Yunyun Wu
user-5edf3a5a4c775e09d87cc848(2019)
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IEEE Transactions on Components Packaging and Manufacturing Technologyno. 9 (2019): 1730-1740
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作者统计
#Papers: 68
#Citation: 2242
H-Index: 23
G-Index: 46
Sociability: 5
Diversity: 2
Activity: 1
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