Xiao Zeng

Xiao Zeng (Member, IEEE) received the B.Sc. and M.Sc. degrees in mechantronics engineering from Xihua University, Chengdu, China, in 2003 and 2007, respectively. He received the Ph.D. degree in microelectronics and solid-state electronics from University of Electronic Science and Technology of China (UESTC), Chengdu, in 2018. He is currently doing research work at UESTC. From 2007 to 2011, he was a Technical Director with Machinery Department, National Institute of Measuring and Testing Technology, Chengdu. From 2011 to 2014, he was a Module Engineer with Assembly Engineering Department, Intel (Chengdu) Corporation. His research interests include broad areas of power electronics, industrial embedded measuring and controlling systems, and failure analysis of semiconductor devices and ICs.