Xiaomin Duan (Member, IEEE) received the M.S. degree in microelectronics and microsystems and the Ph.D. degree (summa cum laude) in electrical engineering from the Hamburg University of Technology, Hamburg, Germany, in 2007 and 2012, respectively. He was a Post-Doctoral Researcher with the Institute of Electromagnetic Theory, Technical University of Hamburg, from 2012 to 2013, and the RF and High Speed Group, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany, from 2013 to 2015. Since 2016, he has been with IBM Germany Research & Development GmbH, Böblingen, Germany. His research interests include signal, power integrity, and EMC for high-speed and RF systems. Dr. Duan was a recipient of the IEEE EMC Best Student Symposium Paper Award in 2009, the IBM Ph.D. Fellowship Award in 2010, and the IEEE Transactions on Components, Packaging and Manufacturing Technology Best Paper Award in 2012 and 2016.