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Research Interests

Papers共 45 篇Author StatisticsCo-AuthorSimilar Experts

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Thermo-Mechanical Reliability Characteristics of 8H HBM3
Jinsoo Bae,H. G. Noh,S. J. Yoo, I. J. Choi,G. H. Bae, Y. M. Shim, S. G. Lee, H. Jang, S. M. Lee, G. H. Chang,K. S. Kwon,C. B. Yoon,Y. S. Lee,J. W. Pyun,J. H. Kim, S. B. Ko,Y. C. Hwang,S. Pae
2024 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS 2024 (2024)
Cited1Views0EIWOSBibtex
1
0
Proposing a Strategy to Prevent Module-level Charged Device Model Failures in Dual In-line Memory Modules
Youngbong Han,Jungho Jin, Jonghyuk Park, Jinhyung Kim,Dohyung Kim,KyoungSun Kim, Yong-Jin Kim, Gyutae Jo, Seonghui Yu, Minjin Kim,Seungbae Lee,Yuchul Hwang
2024 46TH ANNUAL EOS/ESD SYMPOSIUM, EOS/ESD 2024 (2024)
Cited0Views0EIWOSBibtex
0
0
Prediction of Moisture Absorption Characteristics under Normal/Accelerated Preconditioning Condition in Multi Chip Packages
Hyunggyun Noh,Jinsoo Bae,Keunho Rhew, Soojin Yoo, Jiyoung Lim,Yuchul Hwang,Sangwoo Pae
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.254-258, (2024)
Cited0Views0EIWOSBibtex
0
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<1Ppm Device to Chip Level Reliability Characterization for High-Density DDR5 DRAMs
N-H Lee,S. Lee,G J. Kim, Y J. Kim,B W. Woo, Y,H K. Kim, E J. Kim,Y S. Lee,Y C Hwang, S B. Ko,S. Pae
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
Cited0Views0EIWOSBibtex
0
0
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Author Statistics

#Papers: 45

#Citation: 361

H-Index: 11

G-Index: 18

Sociability: 5

Diversity: 2

Activity: 1

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