基本信息
浏览量:107

个人简介
Yifeng Fu (M’15) received the B.S. degree in thermal energy and dynamic engineering from Central South University, Changsha, China, in 2006, and the Ph.D. degree in microsystem integration from Chalmers University of Technology, Gothenburg, Sweden, in 2012.
From 2012 to 2013, he worked as Project Manager and from 2013 to 2015 as Research Manager with SHT Smart High Tech AB, Gothenburg. In 2015, he joined the Department of Microtechnology and Nanoscience, Chalmers University of Technology, where he is currently an Assistant Professor. His current research interests include nanomaterials and processing for microsystem integration, including the synthesis and processing of carbon nanotubes, carbon nanofibers, nanowires, and graphene and related 2-D materials for thermal management and interconnect applications.
研究兴趣
论文共 117 篇作者统计合作学者相似作者
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2022 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING, NORDPAC (2022)
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European Microelectronics and Packaging Conferencepp.1-6, (2021)
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-8, (2021)
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC) (2020)
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作者统计
#Papers: 117
#Citation: 2398
H-Index: 24
G-Index: 45
Sociability: 6
Diversity: 3
Activity: 4
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