基本信息
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Bio
研究领域
先进技术节点CMOS关键工艺与器件架构,超陡亚阈值摆幅低功耗器件,电子自旋/能谷相关新型量子器件,纳米器件中的热电效应与探测,先进TCAD仿真技术与应用。
获奖及荣誉
2016年度,中国科学院海外人才引进项目。
Research Interests
Papers共 251 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
R. J. Jiang, P. Wang, J. X. Yao, X. X. Zhang, L. Cao,J. J. Li, G. Q. Sang,X. B. He, N. Zhou, Y. D. Zhang, C. C. Zhang, Z. H. Zhang,G. B. Bai, Y. H. Lu, L. L. Li, Q. K. Li,J. F. Gao, J. F. Li,Qingzhu Zhang,Huaxiang Yin, J. Luo, B. W. Dai
IEEE ELECTRON DEVICE LETTERSno. 1 (2025): 4-7
Jie Xu, Lei Cao, Yuzhe Yu, Qingkun Li, Hang Zhang, Lianlian Li,Kun Luo,Qingzhu Zhang,Zhenhua Wu,Huaxiang Yin
2025 Conference of Science and Technology of Integrated Circuits (CSTIC)pp.1-3, (2025)
IEEE Transactions on Electron Devicesno. 99 (2025): 1-8
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY (2025): 86-92
Feixiong Wang,Yadong Zhang, Yunjiao Bao,Shuang Liu, Xuexiang Zhang, Shujuan Mao, Mingzheng Ding,Jinbiao Liu, Jiaxin Yao,Qingzhu Zhang,Huaxiang Yin
Hongxiao Lin, Yuanhao Miao, Yuhui Ren,Yongkui Zhang,Qingzhu Zhang, Wenjuan Xiong, Jiahan Yu, Xuewei Zhao,Renrong Liang,Jun Xu,Tianchun Ye,Henry H. Radamson
Journal of Materials Science Materials in Electronicsno. 15 (2025): 1-15
ELECTRONICS LETTERSno. 21 (2024)
Qingxi Jin,Kuo Men,Gangrong Li, Tianlang Ou,Ziwei Lian, Xin Deng,Hongbin Zhao,Qingzhu Zhang,Anjie Ming,Qianhui Wei,Feng Wei,Hailing Tu
ACS Applied Materials & Interfacesno. 22 (2024): 28896-28904
IEEE Electron Device Lettersno. 4 (2024): 566-569
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Author Statistics
#Papers: 255
#Citation: 6267
H-Index: 36
G-Index: 74
Sociability: 8
Diversity: 3
Activity: 45
Co-Author
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- 合作者
- 学生
- 导师
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