Zibing Yang

Zibing Yang received the B.E. degree in biomedical engineering from Southeast University, Nanjing, China, in 1995, and the M.S. and Ph.D. degrees in electrical engineering from Boston University, Boston, MA, USA, in 2000 and 2004, respectively. He joined Sun Microsystems in 2003, working on the I/O circuit of UltraSPARC V microprocessor. Since 2004, he has been with Intel Corp., designing high-speed I/O circuits for multiple Xeon® server CPUs and ASICs. He is currently the lead I/O circuit engineer of the memory interface of Intel's next generation server CPUs. He has many publications and patents.