High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 Μm Pitch
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)（2013）
Key words
Cu/Sn bonding,heterogeneous integration,InP,Near-infrared sensors,3D integration,reliability,microbumps
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