An Improved Substructure Method For Prediction Of Solder Joint Reliability In Thermal Cycle
2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009)（2009）
关键词
finite element modeling,mathematical model,elastic modulus,elastic moduli,creep,system performance,thermal cycling,soldering,finite element methods,material properties,temperature,finite element model,finite element analysis,integrated circuit packaging
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要