Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.

Process Integration for Backside Illuminated Image Sensor Stacked with Analog-to-Digital Conversion Chip

H. H. Chang,C. H. Chien, Y. C. Lee,S. M. Lee,J. C. Wang,Y. W. Huang,C. J. Zhan,Z. C. Hsiao,P. J. Tzeng,C. H. Lee,T. S. Chen,C. T. Ko,W. C. Lo,M. J. Kao

2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2014）

Cited 6|Views24
Key words
Temporary Bonding/De-Bonding,Chip-Package Interaction,Wafer Level Packaging,Interconnections for 3D Integration,Chip on Chip
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined