Fabrication and Testing of a TSV-Enabled Si Interposer with Cu- and Polymer-Based Multilevel Metallization
IEEE Transactions on Components Packaging and Manufacturing Technology（2013）
关键词
Multilevel metallization (MLM),Si interposer,through-Si vias (TSVs)
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要