Integration of a 3-D capacitor into a logic interconnect stack for high performance embedded DRAM SoC technology
Interconnect Technology Conference / Advanced Metallization Conference（2014）
Key words
dram chips,capacitors,integrated circuit interconnections,logic devices,system-on-chip,transistors,3d capacitor,3d tri-gate transistor,dram soc technology,dram cell,soc interconnect stack,array density,generation technology,logic interconnect stack,size 22 nm,temperature 95 degc,capacitance,logic gates,system on chip
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