Development of Electroless Nickel-Iron Plating Process for Microelectronic Applications
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)（2014）
关键词
X-ray spectra,ageing,electroplating,integrated circuits,iron alloys,nickel alloys,phosphorus alloys,printed circuits,reflow soldering,scanning electron microscopy,solders,EDS,Ni3P,NiFe,NiFe alloy,NiFe deposit,Pb-free SnAgCu solder,SEM,SnAgCu,bath aging,bath stability,brittle compound,deposition rate,diffusion barrier layer,electroless NiFe bath,electroless NiFe(P),electroless nickel-iron plating process,electroless nickel-phosphor plating,energy dispersed X-ray spectroscopy,high temperature reflow,interfacial reaction,iron ions,lead-free Sn solders,microelectronic applications,printed circuit board,scanning electron microscopy,solder joints
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