Modeling Multilayer Power/ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks
Electronic Packaging Technology Conference（2012）
Key words
S-parameters,electronics packaging,printed circuit design,PCB-packages,PEC,PMC,bounded parallel plane pairs,current continuity,domain decomposition procedure,electronic packages,equivalent current continuity,interconnected general S-Parameters,multilayer power-ground planes modeling,multiport microwave networks,open plane areas,parallel plane pair multiport network formulation,perfect electric conductor,perfect magnetic conductor,printed circuit boards,spatial computational domain,subdomain boundary
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