Anodic Bonding at Low Voltage Using Microstructured Borosilicate Glass Thin-Films

Leib, J.,Hansen, U.,Maus, S., Feindt, H.

Electronic System-Integration Technology Conference（2010）

引用 6|浏览0

关键词

borosilicate glasses,dielectric thin films,elemental semiconductors,micromechanical devices,silicon,wafer bonding,B2O3-SiO2,Si,anodic bond layer,anodic wafer bonding,bond parameters,bond voltages,microstructured borosilicate glass thin films,size 3 mum to 5 mum,voltage 30 V to 60 V

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