Influence of Trace Geometry on the Current Crowding Effect in Ultra-Fine Pitch MicroBump

Chang, Y.W.,Peng, H.Y.,Yang, R.W.,Chen, C.C.

Microsystems Packaging Assembly and Circuits Technology Conference（2010）

引用 1|浏览11

关键词

current density,finite element analysis,integrated circuit packaging,three-dimensional integrated circuits,3D IC,FEA,Kelvin bump structure,bump resistance,crowding ratio,current crowding effect,electrical behavior,finite elements analysis,line-to-bump structure,microresistance network,multifunction chip development,nonuniform current density distribution,package technique,parametric method,three-dimensional integrated circuit,trace geometry,ultra-fine pitch microbump

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要