300Mm Size Ultra-Thin Glass Interposer Technology and High-Q Embedded Helical Inductor (EHI) for Mobile Application

W. C. Lai, H. H. Chuang, C. H. Tsai, E. H. Yeh,C. H. Lin, T. H. Peng,L. J. Yen,W. S. Liao, J. N. Hung, C. C. Sheu, C. H. Yu, C. T. Wang, K. C. Yee,Doug Yu

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)（2013）

Cited 32|Views0

Key words

elemental semiconductors,glass,inductors,integrated circuit packaging,mixed analogue-digital integrated circuits,silicon,EHI,Q-factor,Si,high-Q embedded helical inductor,hybrid mixed signal heterogeneous chip integration,mobile application,on-glass inductors,power dissipation,power/signal integrity,size 300 mm,size 50 mum,transmission lines,ultra-thin glass interposer technology

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