How to Select Adhesive Materials for Temporary Bonding and De-Bonding of 200mm and 300mm Thin-Wafer Handling for 3D IC Integration?
2011 IEEE 61st Electronic Components and Technology Conference (ECTC)（2011）
Key words
adhesive bonding,electronics packaging,plasma CVD,three-dimensional integrated circuits,wafer level packaging,3D IC integration,PECVD,adhesive materials,de-bonding,packaging assembly process,plasma enhanced chemical vapor deposition,semiconductor fabrication,temporary bonding,thin-wafer handling,vacuum chamber,wafer thinning
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