Study of TSV Filling Performance with Wide-Range Pattern Densities by Using a Novel Plating Chamber with Surface Paddle Agitation

Shang-Chun Chen,Yiu-Hsiang Chang,Yu-Chen Hsin,Chien-Chou Chen,Jui-Chin Chen,Po-Chih Chang,Pei-Jer Tzeng,Sue-Chen Liao, Shin-Chiang Chen,Chung-Chih Wang,Tzu-Chien Hsu,Yu-Ming Lin,Erh-Hao Chen,Cha-Hsin Lin,Tzu-Kun Ku

International Symposium on VLSI Technology, Systems, and Applications（2013）

引用 2|浏览26

关键词

copper,electroplating,three-dimensional integrated circuits,3DIC,Cu,TSV metallization,electroplating chamber,plating chemistry,surface paddle agitation,three-dimensional integrated circuits,through-silicon-via

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