Multi-layer Lamination of Embedded Channels in Low Shrinkage Ceramics Based Platform
2007 9th Electronics Packaging Technology Conference（2007）
Key words
ceramics,firing (materials),laminations,sintering,carbon burnout behavior,carbon fugitive material,dimensionally stable embedded channels,low shrinkage LTCC laminates,low shrinkage ceramics,low temperature co-fired ceramic,multilayer lamination,multistep burnout process,sagging behaviors,suspended LTCC laminates
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